半導体製造サービスの某リーディング プロバイダーが、高度なパッケージングの積極的な拡充をサポートするために、VeecoのAP300を採用

Veeco Instruments Inc. (NASDAQ:VECO) announced today that the world’s largest outsourced assembly and test (OSAT) provider has purchased multiple Veeco AP300™ lithography systems.

半導体製造サービスの某リーディング プロバイダーが、高度なパッケージングの積極的な拡充をサポートするために、VeecoのAP300を採用

ニュース | 2019年1月08日

World’s Largest OSAT Provider Names AP300™ Its Preferred Lithography System Due to Veeco’s Industry-Leading Uptime and Process Performance

PLAINVIEW, New York, Jan. 8, 2019  — Veeco Instruments Inc. (NASDAQ:VECO) announced today that the world’s largest outsourced assembly and test (OSAT) provider has purchased multiple Veeco AP300™ lithography systems. Complementing the OSAT’s previously installed Veeco tools, the AP300 was selected based on its industry-leading uptime and performance with lower total cost of ownership (CoO). This purchase is illustrative of continued strong market demand for Veeco’s lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments.

The AP300 lithography stepper’s winning combination of overlay, resolution, sidewall profile performance and broadband flexibility enables highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the strong market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According to Yole, the equipment and materials market for FOWLP alone will expand at a compound annual growth rate (CAGR) of 43 percent to reach $694 million by 2021.

“Increased mobility, IoT, AI and deep learning are seeing strong growth in step with global megatrends, all of which are enabled by technologies like 3D integration and advanced packaging,” noted Peter Porshnev, Ph.D., senior vice president and general manager of Veeco’s Ultratech business unit. “As we grow our customer base, Veeco’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”

Veecoについて

Veeco (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment. Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. Veecoは性能、歩留り、所有コストを最大化することを意識して設計された装置を提供し、サービスを提供するこれらの市場のすべてで世界をリードするテクノロジーを有しています。To learn more about Veeco’s innovative equipment and services, visit www.veeco.com.

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Veeco Media Contact: David Pinto | 408-325-6157 | dpinto@veeco.com

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