WaferStorm Wet Processing Platform

The WaferStorm platform is the industry choice for a number of critical solvent-based processes in the advanced packaging, MEMs, RF, Data Storage and Photonics markets. There are 2 versions- the Manual Load (ML) and 3300 series platforms. The ML system is well suited for R&D and pilot environments. The 3300-series platform is the high-volume work horse of the industry.

The 3300-series architecture is extremely flexible as the user can have up to 8 chambers per system depending on throughput requirements. In addition, the system is capable of handling multiple wafer sizes and wafer types with minimal hardware modification. Lastly, the process chambers can be stacked vertically leading to extremely low system footprint.

System Architecture

High Volume Platform – 3300 series

1 – 10 chamber modular system
Low footprint- stacked chambers
On board chemical supply
Multiple wafer sizes- 50 to 300mm
Multiple substrate types – Si, LiTaO3, Sapphire, Glass

Manual load platform for R&D – ML

Single chamber- manual load

WaferStorm 3300 Series Platform Manual Load Platform

Solvent Applications

Metal Lift-Off

Metal Lift-Off (MLO) is a critical process in the compound semiconductor and RF markets where metals cannot be easily etched without damaging the underlying substrates. The WaferStorm system with ImmJET technology is the market share leader for Metal Lift-Off globally. ImmJET technology is a combination of batch immersion and single wafer spray processing. The immersion step uses heated solvents with agitation. After being softened by the immersion, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick film residue. This combination ensures superior process performance while maintaining the lowest CoO versus wet bench and single wafer solutions.

Photoresist/Dry Film Strip

The WaferStorm system with ImmJET technology delivers superior process performance and low cost of ownership for the customer for photoresist strip and dry film strip applications. Especially, when the resists are thick and difficult to remove, the combined immersion and high-pressure spray ensures material removal. In addition, proprietary filtration technology enables low downtime and high productivity.

Flux Clean

高度なパッケージングでは、ウエハのバンピングおよび接合の形成プロセスにフラックス洗浄が不可欠です。これによって、酸化層とハンダの原料によって残留した他の不純物が除去され、この後のアセンブリステップのために金属界面が清潔に保たれます。液状のフラックス剤はバンプ面に付着するため、追加の洗浄ステップを使用して、取り残された残留物を除去する必要があります。バンプピッチが微細になるにつれ、フラックス塗布の残留物の除去がさらに困難になります。WaferStormプラットフォームに搭載されているVeecoの特許権を有する液浸および噴霧テクノロジーは、条件の厳しい領域からのフラックス剤の残留物の除去に特に適しています。

Scrubber

Veeco PSPの片面および両面枚葉処理洗浄技術は、多くの用途で高効率のパーティクル除去を実現します。Veecoの特許取得済みの両面PVAブラシシステムは、上面、底面および側面を洗浄します。追加の片面PVAブラシスクラブ技術は、すべてのウエハサイズで最も効果的な洗浄結果を得るために、高速噴霧（HVS）およびメガソニックとともに利用できます。

TSV Clean

TSV洗浄は、信頼性に不可欠で重要なプロセスステップです。深堀り反応性イオンエッチング（DRIE）プロセスでは、その後のバリア、シードおよび充填ステップで欠陥とボイドを発生させる可能性のある、ポリマー残留物が取り残されます。The WaferStorm with ImmJET technology relies on the sequential combination of the immersion and high-pressure spray processes to remove residues in high-aspect-ratio holes that wet bench-only or spray-only tools leave behind.